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The limitation of mechanical polishing was said around fundamental 70MHz so far. However, We have pursued the mechanical polishing technology for a long time. And then we succeeded around fundamental 135MHz crystal blanks. Our products is obviously advantageous compared to the characteristics of the chemical process products.

We lap crystal wafer up to around fundamental 135MHz by double side lapping.
In addition, we can polish or etch.

High Frequency Fundamental Special Properties

Maximum Frequency
#4000 Abrasive process
Fundamental 1Mhz-137MHz

Polishing Process(double-side polishing)
Fundamental 1Mhz-137MHz
3rd Overtone 1Mhz-411MHz

Roughness and Flatness
Blank surface is very smooth and flat.
We use finer granularity abrasive for electrical characteristics.

High yield rate
Each crystal blank is very uniform in thickness and resonance wave.

Fundamental 111MHz blank data

100MHz waveform data
Measurement condition
>directly measure the
  blanks before vaccum
  evaporation.
>Network analyzer
>Under air
>5db / 1 space

3rd overtone 334MHz blank data

333MHz waveform data
Measurement condition
>directly measure the
  blanks before vaccum
  evaporation.
>Network analyzer
>Under air
>5db / 1 space

136MHz waveform data
Measurement condition
>directly measure the
  blanks before vaccum
  evaporation.
>Network analyzer
>Under air
>5db / 1 space

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Manufacture quartz crystal blank for crystal resonator and oscillator.

1140, Tsukigata, Minami-ku, Niigata-shi, Niigata-ken,950-1304, Japan TEL+81-25-375-5085
Copyright (c) 2012 TANABE. All rights reserved.